Core Advantages▪ Void-free copper filling up to 15:1 aspect ratio, with within-panel uniformity below 10%
▪ Independent multi-anode control for the center, four sides, and four corners, with precise regulation of pulse forward and reverse currents and an optimized paddle grid design
▪ Integrated delivery of equipment, proprietary plating chemistry, and process recipes, significantly shortening customer qualification cycles
▪ Purpose-built vertical electroplating architecture for 510 x 515 mm panels, featuring automatic rack cleaning, lifecycle management, and uptime of at least 95%

Core Advantages▪ High-speed electroplating enables improved uniformity control
▪ Horizontal plating chambers to eliminate cross-contamination
▪ Individual chamber maintenance capability to maximize equipment uptime
▪ Rubber Seal technology for superior sealing performance
▪ Flexible process control for enhanced adaptability

Core Advantages▪ Supports diverse process requirements including TSV, TGV, RDL, BUMP, and various substrate types
▪ Excellent cleaning performance, ensuring no metal layer oxidation
▪ Equipped with EAP system and video monitoring for enhanced process control
▪ PLC + PC control system with bilingual (Chinese-English) user interface, including free software upgrades

Core Advantages▪ Wafer compatibility:In fully automatic mode, supports warped wafers with bow ≤ 5 mm and thicknessfrom 200 μm to 1500 μm
▪ System stability:Uptime ≥ 95%, MTTR (Mean Time To Repair) ≤ 4 hours, MTBF (Mean Time Between Failures) ≥ 250 hours
▪ Compliance:Software and operation conform to SEMI S2 standards, Supports SECS/GEM communication protocol, Alarm logs, production records, and event tracking are all accessible for review

Core AdvantagesMainly used for wafer-grade packaging UBM corrosion. The metal layer includes: Ti TiN TiW Cu Au, etc.