◎ High-Aspect-Raio TSV Electroplating System (Axtra 30)·High-Aspec-Raio TGV Electroplating System (Supra P500) · Fuly Automated Nickel-Palladium-Gold Plating System

◎ Wafer Fabrication · Advanced Packaging

◎ IS0 Cerifications for Quality, Environmental and Occupational Health and Safety Management Systems · CE Certification · Proprietary Patents and Software Copyright Registration Certificates

◎ Void-Free Filling for High-Aspect-Ratio Features：Void-free copper filling up to 15:1 aspect ratio, with within-panel uniformity below 10%

◎ Multi-Anode Electric Field Control：Independent multi-anode control for the center, four sides, and four corners, with precise regulation of pulse forward and reverse currents and an optimized paddle grid design

◎ Turnkey Closed-Loop Solution：Integrated delivery of equipment, proprietary plating chemistry, and process recipes, significantly shortening customer qualification cycles

◎ Dedicated Panel-Level Architecture：Purpose-built vertical electroplating architecture for 510 x 515 mm panels, featuring automatic rack cleaning, lifecycle management, and uptime of at least 95%