◎ Wafer Compatibility:Compatible with various wafer sizes: 4-inch, 6-inch, 8-inch, and 12-inch

◎ Customizable Automation:Configurable with 2 to 28 plating chambers

◎ Supports multiple plating metals:Cu, Ni, SnAg, Sn, Au, etc.

◎ Within-wafer uniformity:＜5%

◎ Wafer-to-wafer uniformity:＜3%

◎ Wafer warpage handling capability:＜3 mm

◎ Wafer breakage rate:＜10ppm

◎ High-speed electroplating enables improved uniformity control

◎ Horizontal plating chambers to eliminate cross-contamination

◎ Individual chamber maintenance capability to maximize equipment uptime

◎ Rubber Seal technology for superior sealing performance

◎ Flexible process control for enhanced adaptability