◎ Wafer Compatibility:Supports 4-inch, 6-inch, 8-inch, and 12-inch wafers

◎ Customizable automation levels:Manual, semi-automatic, and fully automatic configurations available upon request

◎ Deposition rates:Ni＞180nm/min，Pd＞30nm/min，Au＞4nm/min

◎ Film thickness uniformity:Ni＜10%，Pd＜10%，Au＜10%

◎ Wafer breakage rate:＜10ppm

◎ Wafer compatibility:In fully automatic mode, supports warped wafers with bow ≤ 5 mm and thicknessfrom 200 μm to 1500 μm

◎ System stability:Uptime ≥ 95%, MTTR (Mean Time To Repair) ≤ 4 hours, MTBF (Mean Time Between Failures) ≥ 250 hours

◎ Compliance:Software and operation conform to SEMI S2 standards, Supports SECS/GEM communication protocol, Alarm logs, production records, and event tracking are all accessible for review