◎ Compatible with various sizes: Wafers: 4-inch, 6-inch, 8-inch, and 12-inch, Compatible with square panels ranging from 100mm to 600mm

◎ Flexible plating tank configuration based on capacity requirements, supporting Au, Cu, Ni, SnAg, Sn, and other metal electroplating

◎ Customizable automation levels:Manual, semi-automatic, or fully automatic systems available upon request

◎ Uniformity:＜5%

◎ Wafer breakage rate:＜10ppm

◎ Supports diverse process requirements including TSV, TGV, RDL, BUMP, and various substrate types

◎ Excellent cleaning performance, ensuring no metal layer oxidation

◎ Equipped with EAP system and video monitoring for enhanced process control

◎ PLC + PC control system with bilingual (Chinese-English) user interface, including free software upgrades